Thermaltake CL-O024-GROSGM-A TG-50 Thermal Diamond Compound Thermal Paste – 4G

Thermaltake CL-O024-GROSGM-A TG-50 Thermal Diamond Compound Thermal Paste – 4G

Thermaltake CL-O024-GROSGM-A TG-50 Thermal Diamond Compound Thermal Paste – 4G

R249.00

In stock

R249.00

– Premium Thermal Compound
– Thermal Conductivity: 8.0 W/m-k
– Contains Diamond Powder For Better Heat Transfer
– Honeycomb Stencil Included To Ensure A Neat And Well-Covered Surface

SKU: CL-O024-GROSGM-A-TR Category:
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Description

TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

High Thermal Conductivity

With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamond powder allowing users to pursue a higher heat transfer rate.

Easy to Apply

Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

All-In-One Application Kit

This thermal compound application kit includes a set of easily-applied tools for immediate use.

Sustainability and Safety

The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.

SPECIFICATIONS
Brand Thermaltake
Series Thermal Paste Series
Model CL-O024-GROSGM-A
Thermal Conductivity 8 W/m-k
Viscosity 47Pa-s
Thermal impedance 0.035°C -in²/W
Density 2.9 g/cm³
Colour Grey
Weight 4g
Features With A Thermal Conductivity Of 8.0 W/m-k, The Thermal Compound Also Contains Diamonds Powder Allowing Users To Pursue A Higher Heat Transfer Rate
Thermaltake’s Specially Formulated Thermal Compound Fits Perfectly With The Honeycomb Stencil, Which Provides An Easier Way To Apply Your Thermal Compound For A Neat And Well-Covered Surface That Fits All CPUs
This Thermal Compound Application Kit Includes A Set Of Easily-Applied Tools For Immediate Use
The High-Quality Thermal Compound Provides A Longer Lifespan Of Eliminating Dry-Out Or Cracking While In Use
Non-Electrical Conductive Compound Ensures Better Safety Measures For You And Your System

1 Year

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